TELCORDIA SR-332 ISSUE 3 PDF

Bellcore TR Issue 6 (); Telcordia SR Issue 1 (); Telcordia Telcordia Issue 3, the latest version of the standard, introduced several major. SR ISSUE 3 Reliability Prediction Procedure For Electronic Equipment Specifies recommended methods for predicting Publisher: Telcordia Technologies. Telcordia continues to revise and update the standard. The latest two updates are SR Issue 2 (September ) and SR Issue 3 (January ), both .

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Although empirical prediction standards have been used for many years, it is always wise to use them with caution.

Accurate prediction of the reliability of electronic products requires knowledge of the components, the design, the manufacturing process and the expected operating conditions. These techniques estimate the mean failure rate in FITs for electronic equipment. Time plot and calculated B10 life for the analysis.

The failure rate for a part under the reference conditions is calculated as:.

srtelcordia-issue-3

Each approach has its unique advantages and disadvantages. Back to desktop version Back to mobile version.

A given electronic component will have multiple failure modes and the component’s failure issuue is equal to the sum of the failure rates of all modes i. The most common failure mode is “conductor open.

FAQ: What is Telcordia SR?

These trlcordia estimate the mean failure rate in FITs for electronic equipment. Iwsue life testing method can provide more information about the product than the empirical prediction standards. Because of dissatisfaction with military handbook methods for their commercial products, Bellcore designed its own reliability prediction standard for commercial telecommunication products. There are reasons for this variation.

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A model known as the modified Coffin-Manson model has been used successfully to model crack growth in solder due to repeated temperature cycling as the device is switched on and off.

Bellcore/Telcordia Reliability Prediction in Lambda Predict

Several popularly used models are discussed next. This model takes the form [9]:. Finally, we will discuss life testing methods, which are used to determine reliability by testing a relatively large number of samples at their specified operation stresses or higher stresses and using statistical models to analyze the data.

The advantages and disadvantages of empirical methods have been discussed a lot in the past three decades. Method III is a statistical prediction of failure rate based on field tracking data collected in accordance with specific SR criteria. However, if you think your products do not exhibit a constant failure rate and therefore cannot be described by an exponential distribution, the life characteristic usually will not be the MTBF. Therefore, the prediction is usually more accurate, given that enough samples are used in the testing.

On the other hand, with the life testing method, since the failure data from your own particular products are obtained, the prediction results usually are more accurate than those from a general standard or model. Clarification and guidance on items raised by forum participants and by frequently asked questions from users.

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The usage temperature level is Kelvin. The model takes the following form. An extended range of complexity for devices, and the addition of new devices. Revised generic telcorrdia failure rates in Section 8, based mainly on new data for many components.

Issue 3 of SR contains tables needed to facilitate the calculation of reliability predictions. Since electronic products usually have a long time period of useful life i. Issue 3 of SR contains new temperature curves for miscellaneous devices. Method II is based on combining Method Teclordia predictions with data from laboratory tests performed in accordance with specific SR criteria. Articles Fault Tolerance for Digital Systems. Hot carrier injection describes the phenomena observed in MOSFETs by which the carrier gains sufficient energy to be injected into the gate oxide, generate interface or bulk oxide defects and degrade MOSFETs characteristics such as threshold voltage, transconductance, etc.

Issue 4 of SR contains: This procedure also documents a recommended method for predicting serial system hardware reliability.